📖 MagicON AI - Complete User Guide¶

RF Module Designer & PCB Stackup Designer

Version: 3.1.1 Last Updated: May 19, 2026 For: Web Application v3.1.1+
Documentation Version Control: See Version History section

🎯 Quick Start¶

Accessing the Application¶

Simply navigate to:

🌐 https://pcbgenerator.com

No Installation Required!

MagicON AI is a web-based application - just open your browser and start designing!

System Requirements: - ✅ Modern web browser (Chrome, Firefox, Edge, Safari) - ✅ Internet connection - ✅ JavaScript enabled

Getting Started: 1. Open the web app 2. Accept the disclaimer (first-time only) 3. Choose your tool: RF Module Designer, PCB Stackup Designer, or PA Selector 4. Start designing!

🌟 Application Overview¶

Three Main Tools:¶

🔬 RF Module Designer - AI-driven RF transmitter chain design
📊 PCB Stackup Designer - Multi-layer PCB stackup calculator
⚡ PA Selector - Standalone power amplifier selection tool

Key Features:¶

✅ AI-Driven Component Selection - Automatically select optimal components from 2,400+ validated RF components
✅ Complete 5-Phase Workflow - All phases fully operational and tested end-to-end
✅ Component Alternatives - See why each component was chosen with top 5 alternatives
✅ Real-Time Validation - Electrical stress analysis and BOM validation (10/10 stress tests)
✅ Multiple Export Formats - KiCad, ODB++, ADS (requires sign-in for CAD downloads)
✅ Design Reasoning - Understand trade-offs and decisions with transparent scoring
✅ Freemium Access - Use all features free, sign-in only required for CAD file downloads
✅ Advanced Materials - MEGTRON6 ultra-low loss materials, 50+ material database
✅ Enhanced Thermal Analysis - Professional thermal design validation with CTE analysis
✅ Up to 32-Layer Stackups - Support for complex high-density designs

🔬 RF Module Designer¶

Purpose: Design complete RF transmitter chains with AI-driven component selection

Phase-Based Design Workflow:¶

The RF Module Designer uses a 5-phase sequential workflow:

⚙️ PHASE 1: Requirements & Specifications
           ↓
🧱 PHASE 2: Block Diagram & Components  
           ↓
📉 PHASE 3: Link Budget & Simulation
           ↓
📝 PHASE 4: Passive Design & Integration
           ↓
✍️ PHASE 5: Schematic & Verification

📋 Phase 1: Requirements & Specifications¶

What to enter:

Frequency (GHz)
Example: 2.4 for WiFi, 5.8 for 5G
Range: 0.1 - 40 GHz
Target Output Power (dBm)
Example: 30 for 1W output
Typical range: 20-40 dBm
Application
Options: WiFi, Bluetooth, 5G, Radar, Satellite, Custom
Affects component selection priorities
Efficiency Target (%)
Example: 30 for 30% PAE
Higher efficiency = lower power consumption
Supply Voltage (V)
Example: 12 for 12V main board supply
Used for power converter design

Tips: - 💡 Higher frequencies need specialized components (more expensive) - 💡 Higher power needs more gain stages (more complexity) - 💡 Efficiency vs power is a trade-off

Click "Continue to Phase II" when done →

🧱 Phase 2: Block Diagram & Components¶

This is where the AI shines! 🤖

Enable AI Component Selection:¶

Toggle the checkbox:

🤖 Enable AI Agent Component Selection (All Components)
Intelligently selects VCO, PA, Driver, Filter, Connector & Substrate components

What happens: 1. AI analyzes your requirements from Phase 1 2. Searches component database (2,400+ validated RF components) 3. Scores each component based on multiple factors: - Frequency match - Power handling - Gain efficiency - Cost - Availability 4. Selects optimal RF chain with automatic: - VCO (Voltage Controlled Oscillator) - Predriver / Driver amplifiers - Power Amplifier (PA) - Attenuators (for power control) - Filters (bandpass, output) - Circulator (PA protection) - Connector

Understanding the Chain Diagram:¶

Signal Flow View:

VCO → Attenuator → Predriver → Attenuator → Power Amplifier → 
Bandpass Filter → Circulator → Output Filter → Connector → RF OUTPUT

Each component shows: - Part number - Output power (dBm) - Gain or loss - Status indicators (✓ Linear, 🔥 High power)

Component Details Panel:¶

Click any component to see 3 tabs:

1. Specs Tab: - Part number and manufacturer - Frequency range - Power/gain specifications - Efficiency, cost, availability - Package type

2. Reasoning Tab: 🆕 - Why this component? Primary selection reasons - Strengths: What makes it good - Weaknesses: Trade-offs made - Trade-offs: Comparisons with alternatives - Design Impact: How it affects overall chain - Scoring Details: Algorithm transparency (expandable)

3. Alternatives Tab: 🆕 - Top 5 alternatives ranked by score - Pros/Cons for each alternative - Why not selected: Specific technical reasons - Available for: VCO, Driver, PA

Info Icons (ℹ️):¶

Hover over the info icon next to any component for a quick tooltip showing: - Selection reasoning - Key specs - Why chosen - Main trade-offs

Click info icon for full details in the Component Details panel.

Chain Analysis:¶

Metrics Tab: - Total Gain: Combined amplification - Output Power: Final RF output - DC Power: Total power consumption - PA Efficiency: Power-added efficiency - Loss Analysis: Where power is lost - BOM Cost: Total component cost

Design Strategy Tab: 🆕 Shows the AI's design logic: - Design Goals: Target specs - Design Strategy: Component selection rationale - Key Decisions: Why this architecture? - Design Summary: Overall performance

Selected Components List:¶

Shows all components with: - Part number - Manufacturer - Function - Cost and availability - Info icon for reasoning 🆕

Power Delivery Network (PDN):¶

Automatically designs: - Power converters (BUCK/BOOST) - Voltage rails for each component - Power flow diagram - Efficiency calculations

Bill of Materials (BOM):¶

Export formats: - CSV - Spreadsheet format - Excel - Full workbook with formulas

Includes: - Designators (U1, U2, FL1, etc.) - Part numbers - Manufacturers - Descriptions - Quantity, cost, availability - Package types

Electrical Stress Analysis: 🆕¶

Validates your design: - Power overload detection - Example: "L254XF3S receiving 34.7 dBm but max is 30.0 dBm" - Thermal stress (future) - Voltage stress (future)

Shows suggestions to fix issues: - Replace with higher-rated component - Add protection circuitry - Adjust power levels

Click "Continue to Phase III" when satisfied →

📉 Phase 3: Link Budget & Simulation ✅ FULLY OPERATIONAL¶

Status: ✅ PRODUCTION READY - All features implemented and tested (November 2025)

Available Features:

Power Flow Analysis:¶

Complete RF chain power budget - Visual power flow from VCO to output
Gain/loss tracking - See power at each stage with detailed breakdown
Efficiency calculations - System-level and component-level efficiency (PAE)
DC power consumption - Total system power requirements with rail-by-rail breakdown
Power flow visualization - Interactive diagram showing signal path and power levels

BOM Validation & Stress Testing:¶

10/10 stress tests passed - Comprehensive validation suite ✅
Power overload detection - Identifies components exceeding ratings in real-time
Electrical stress analysis - Validates all components against specifications
Actionable suggestions - Specific recommendations to fix issues with component replacements
Validation summary - Clear pass/fail indicators with detailed error messages

Link Budget Metrics:¶

Total Gain - Combined amplification through entire chain (dB)
Output Power - Final RF output power (dBm) with target comparison
Post-PA Loss - Critical loss after power amplifier (must be < 4 dB)
DC Power - Total system power consumption (Watts)
PA Efficiency - Power-added efficiency (PAE %)
BOM Cost - Complete component cost breakdown with availability status

Chain Analysis Display:¶

Metrics Tab - All key performance parameters in one view
Design Strategy Tab - AI's design logic and decision rationale
Power Flow Diagram - Visual representation of signal path
Color-coded Status - Green (within spec), Yellow (warning), Red (overload)

What You'll See: - Visual power flow diagram showing complete signal path - Color-coded components (green = within spec, red = overload) - Detailed metrics table with all key parameters - Validation results panel with errors and actionable suggestions - Real-time updates as you modify the design

Example Output:

Total Gain: 15.7 dB
Output Power: 30.8 dBm (target: 30 dBm) ✓
DC Power: 17.09 W
PA Efficiency: 19.3% PAE
Post-PA Loss: -3.75 dB
BOM Cost: $156.42
Validation: 10/10 tests passed

Click "Continue to Phase IV" when validated →

📝 Phase 4: Passive Design & PCB Integration ✅ FULLY OPERATIONAL¶

Status: ✅ PRODUCTION READY - All features implemented and tested (November 2025)

Available Features:

PCB Stackup Generation:¶

Up to 32 layers - Support for complex high-density designs ✨
Multiple HDI types - Single lamination, HDI-1, HDI-2, HDI-3, HDI-4 stackups
Smart layer management - Automatic core/prepreg assignment with thickness optimization
Material selection - 50+ materials including MEGTRON6 ultra-low loss ✨
Auto-thickness matching - System automatically finds closest available thickness when changing materials

Stackup Visualizers:¶

Sequential stackup view - Layer-by-layer visualization
Impedance calculator - Real-time microstrip and stripline calculations
Via calculator - HDI microvia specifications and visualization
Thermal analysis - Enhanced thermal design validation with CTE analysis ✨

Material Database:¶

FR4 variants - FR408, FR4, IS410 (standard applications)
Rogers materials - RO4003C, RO4350B, RO3003 (high-frequency)
MEGTRON6 - Panasonic's premium ultra-low loss material ✨
Frequency coverage: 1-40 GHz
18 thickness options: 0.050mm to 0.925mm
Thermal properties: Tg=185°C
Taconic materials - RF-35, TLY-5 (high-performance)
Isola materials - IS410, I-Tera MT

Enhanced Thermal Analysis: ✨¶

CTE Analysis - Coefficient of thermal expansion validation and mismatch detection
Operating Temperature Ranges - Application-specific limits (Consumer, Automotive, RF/Microwave)
Heat Capacity Analysis - Thermal mass calculations and time constant estimation
Thermal Validation - Industry-standard design rule checking with professional recommendations
Performance Optimized - Instant analysis with intelligent layer filtering

Design Features:¶

Layer configuration - Signal, Power, Ground, Mixed layer types
Copper thickness - 0.5 oz (17.5μm) to 2 oz (70μm)
Total thickness control - Target finished thickness with automatic layer adjustment
Material property updates - Dk/df values update correctly when changing materials ✨

What You'll See: - Interactive stackup editor with drag-and-drop layer reordering - Real-time impedance calculations as you adjust parameters - Visual stackup diagram with material properties - Thermal analysis summary with expert recommendations - Export-ready stackup configuration

Example: 6-Layer Stackup (1.47mm)

L1: Signal (35μm Cu) - FR408
L2: Ground (35μm Cu) - FR408
L3: Signal (35μm Cu) - FR408 (Stripline)
L4: Power (35μm Cu) - FR408
L5: Ground (35μm Cu) - FR408
L6: Signal (35μm Cu) - FR408

Click "Continue to Phase V" when stackup is configured →

✍️ Phase 5: Schematic & Verification ✅ FULLY OPERATIONAL¶

Status: ✅ PRODUCTION READY - All features implemented and tested (November 2025)

Available Features:

Bill of Materials (BOM) Export:¶

Complete BOM generation - All components with designators, part numbers, costs
Export formats:
CSV - Spreadsheet format for easy import
Excel - Full workbook with formulas and formatting
BOM Summary:
Total items count
Total cost (e.g., $157.37)
In-stock component count
Validation status

KiCad Export (.kicad_pcb, .kicad_pro)
Complete KiCad project with schematic, PCB, and symbols
Native KiCad API generation
Ready for layout and routing
ODB++ Export ✅ PRODUCTION READY
Binary format with proper directory structure
Tested and verified with Keysight ADS
Industry-standard manufacturing format
ADS Export (.subst)
Keysight ADS substrate file
For signal integrity simulation
Includes all material properties

Freemium Access Model

All application features are free to use! Sign-in is only required when downloading CAD files (KiCad, ODB++, ADS exports). You can explore the full application, generate designs, and use all tools before creating an account.

Design Verification:¶

DFM Validation - Design for Manufacturing checks
PCB Design Rule Checker - Validate KiCad PCB files against manufacturer capabilities
Support for JLCPCB, PCBWay, and TTM Technologies
Client-side validation (no file uploads)
Real-time design rule checking
Final validation summary - Complete design status report

Design Complete Summary:¶

Design overview - Complete RF module specifications
Component count - Total components in design
Performance metrics - Final output power, efficiency, cost
Export status - Available export formats
Next steps - Recommendations for manufacturing

Start New Design:¶

"Start New Design" button - One-click reset to Phase 1 ✅
Data persistence - Your current design is saved in browser
Quick restart - Begin new design without losing previous work

What You'll See: - Complete BOM table with all components - Export buttons for each format (sign-in required for CAD files) - Design complete celebration UI - Validation summary with pass/fail status - "Start New Design" button for quick reset

Example BOM Output:

Total Components: 10
Total Cost: $157.37
In Stock: 10/10
Validation: All tests passed ✓

Components:
U1: LMX2581 (VCO) - $0.00 (sample)
U2: CMD244K5 (Predriver) - $12.50
U3: TGA2214 (PA) - $0.00 (sample)
...

Design Complete! 🎉

📊 PCB Stackup Designer¶

Purpose: Calculate and visualize multi-layer PCB stackups

How to Use:¶

Step 1: Select Layer Count¶

2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, or 32 layers ✨
More layers = more routing options but higher cost
Up to 32 layers supported for complex high-density designs

Step 2: Configure Layers¶

For each layer: 1. Type: Signal, Power, Ground 2. Copper Thickness: 0.5 oz (17.5μm) to 2 oz (70μm) 3. Material: FR4, Rogers (RO4003C, RO4350B), Taconic, Isola 4. Dielectric Thickness: Auto-suggested or manual

Material Selection: - FR4: <1 GHz, cost-effective - Rogers RO4003C: 1-10 GHz, low loss - Rogers RO4350B: 1-30 GHz, very low loss - MEGTRON6: ✨ NEW! Panasonic's premium ultra-low loss material - Frequency: 1-40 GHz - 18 thickness options: 0.050mm to 0.925mm - Ultra-low loss: Df = 0.002 @ 10 GHz - Thermal: Tg = 185°C - Taconic RF-35: High-frequency, high-performance

Step 3: Set Total Thickness¶

Common: 1.6mm (standard), 2.0mm (high-layer-count)
System auto-distributes dielectric thickness

Step 4: Validate¶

Impedance: Check 50Ω/75Ω/90Ω traces
DFM Rules: Manufacturing constraints
Thermal: Heat dissipation capacity

Advanced Features:¶

Impedance Calculator:¶

Microstrip: Surface traces
Stripline: Embedded traces
Differential Pairs: Coupled traces
Real-time impedance as you adjust parameters

Via Technology:¶

Through-hole: Standard vias
HDI-1 to HDI-4: Microvia options
Auto-calculate via sizes and spacing

Material Library:¶

50+ PCB materials
Frequency-dependent properties
Cost estimates
Manufacturer data

Export Options:¶

KiCad Export (.kicad_pcb, .kicad_pro)
Import directly into KiCad 6.0+
Stackup configuration included
Ready for layout
ADS Export (.subst)
Keysight ADS substrate file
For signal integrity simulation
Includes all material properties
CSV Export
Manufacturing documentation
Material specifications
Layer stackup table
ODB++ Export
Manufacturing data format
For PCB fabrication
Industry standard

⚡ PA Selector Tool¶

Purpose: Standalone power amplifier selection for quick designs

How to Use:¶

Enter Requirements:
Frequency (GHz)
Output Power (dBm)
Supply Voltage (V)
Efficiency Target (%)
AI Selects PA:
Searches PA database
Scores based on requirements
Shows top 5 candidates
View Results:
Selected PA with full specs
Reasoning for selection
Alternative options
Cost and availability

Use Cases: - Quick PA evaluation - Component comparison - Early-stage design exploration - Education and learning

🤖 Component Selection AI¶

How It Works:¶

Our AI uses multi-factor scoring algorithms:

Power Amplifier (PA) Selection:¶

Power Match (30%): Meets output requirement
Gain Efficiency (25%): Optimal gain for your chain
Cost (20%): Budget considerations
Availability (15%): In-stock preference
Frequency Match (10%): Operating range

Driver Selection:¶

Attenuator Minimization (30%): Avoid excessive attenuation
Target Optimization (25%): Optimal output power
Power Handling (15%): Adequate P1dB margin
Efficiency (10%): Power consumption
Cost (5%): Budget

VCO Selection:¶

Power Suitability (70%): Optimal output level
Frequency Match (10%): Center frequency
Efficiency (13%): DC power usage
Cost (5%): Budget
Availability (2%): Stock status

Understanding Component Reasoning:¶

Info Icons (ℹ️):¶

Hover any info icon to see:

Why TGA2214?

PRIMARY REASONS
• Optimal gain: 25.4 dB
• Perfect power match: 38.1 dBm max
• Minimizes driver requirements

STRENGTHS
• In stock at $0 (sample)
• Broadband: 2-18 GHz
• Proven reliability

TRADE-OFFS
• 20% efficiency (vs 25% alternatives)
• Higher gain needs more attenuation

Alternatives Tab:¶

Click any component → Alternatives tab to see: - Top 5 alternatives ranked by score - Pros: What makes them attractive - Cons: Why they weren't selected - Specific reasons: Technical explanation

Example:

Alternative #2: MMGP003 (Score: 94.5, Rank: 2)

Pros:
✓ Better efficiency (25% vs 20%)
✓ Higher power (40 dBm vs 38.1 dBm)

Cons:
✗ Lower overall score (94.5 vs 93.2)
✗ Caused attenuator gap (19 dB unavailable)

Why not selected:
"Would have failed design due to missing 19 dB attenuator"

Scoring Transparency:¶

In Component Details → Reasoning tab → Expand "Advanced: Scoring Details":

See the exact algorithm:

Scoring Breakdown

Criterion              Weight    Score    Contribution
─────────────────────────────────────────────────────
Power Match            30%       98/100   29.4
Gain Efficiency        25%       95/100   23.8
Cost                   20%       100/100  20.0
Availability           15%       100/100  15.0
Frequency Match        10%       50/100   5.0
─────────────────────────────────────────────────────
TOTAL SCORE                               93.2

🔧 RF Module Designer - Detailed Guide¶

Phase 1: Requirements¶

Required Inputs:

Field	Description	Example	Tips
Frequency	Operating frequency in GHz	2.4	WiFi: 2.4/5, 5G: 3.5/28, Satellite: 10-30
Output Power	Target RF output in dBm	30	30 dBm = 1W, 33 dBm = 2W, 37 dBm = 5W
Application	Use case	WiFi	Affects component priorities
Efficiency	Target PAE	30	Higher = lower DC power but harder
Supply Voltage	Main board input voltage	12	Common: 5V, 12V, 24V, 48V

Power Conversion Chart:

dBm  |  Watts  |  Use Case
───────────────────────────
20   |  100mW  |  Short range (BT, IoT)
23   |  200mW  |  Medium range (WiFi)
27   |  500mW  |  Long range
30   |  1W     |  Base station, AP
33   |  2W     |  High power AP
37   |  5W     |  Point-to-point link
40   |  10W    |  Broadcast, radar

Example: 2.4 GHz WiFi Access Point

Frequency: 2.4 GHz
Power: 30 dBm (1W)
Application: WiFi
Efficiency: 25%
Supply: 12V

Click "Continue to Phase II" →

Phase 2: Block Diagram & Components¶

Current Specifications Panel:¶

Shows locked specs from Phase 1: - Frequency - Power - Application - Standards

📝 Edit Phase I button to go back and change requirements

AI Component Selection:¶

Enable the AI toggle:

🤖 Enable AI Agent Component Selection

What AI does automatically: 1. Calculates required PA output power 2. Selects optimal PA from database 3. Calculates required driver stages 4. Selects VCO with appropriate output 5. Inserts attenuators for power control 6. Selects filters for harmonics 7. Adds circulator for PA protection 8. Designs power delivery network 9. Validates electrical stress 10. Generates complete BOM

Manual Override: - Click any component to see alternatives - Swap components (future feature) - Adjust attenuator values (future)

Component Tooltips:¶

Hover any component's info icon (ℹ️) to see instant reasoning:

Click info icon for full details in Component Details Panel (3 tabs: Specs, Reasoning, Alternatives)

Chain Analysis:¶

Metrics Tab: - Total Gain: 15.7 dB (example) - Output Power: 30.8 dBm (meets 30 dBm target ✓) - DC Power: 17.09 W (system consumption) - PA Efficiency: 19.3% PAE - Post-PA Loss: -3.75 dB (critical for output power) - BOM Cost: $156.42

Design Strategy Tab: 🆕 See the AI's design logic:

DESIGN GOALS
• Target: 30 dBm @ 2.4 GHz
• Budget: < $200
• Efficiency: Priority

DESIGN STRATEGY
1. VCO Selection
   → LMX2581: 12 dBm output, 0.05-3.76 GHz
   Reason: Broadband VCO minimizes BOM variants

2. Amplification Path
   → CMD244K5: 17.5 dB gain predriver
   → TGA2214: 15.7 dB gain PA
   Reason: Two-stage design for optimal efficiency

3. PA Selection
   → TGA2214: 25.4 dB gain, 38.1 dBm max
   Reason: Optimal gain/power for 30 dBm target
   Alternative: MMGP003 failed (attenuator gap)

4. Post-PA Protection
   → L254XF3S BPF: Harmonic suppression
   → RCI-2G4-S1 Circulator: PA protection
   → CF-02600101 Filter: Final cleanup

Power Delivery Network:¶

Power Flow Diagram:

Main Input (12V) → BUCK Converter → 3.3V Rail (VCO)
                                  → 8V Rail (Driver)
                                  → 22V Rail (PA)

Shows: - Converter efficiency - Current per rail - Load percentage - Total power loss

Power Rail Assignment: Each rail shows: - Voltage level - Total current - Connected components - Converter capacity and load %

Bill of Materials:¶

Summary: - Total items - Total cost - In stock count - Validation errors

Validation Results:

Errors: 🔴

POWER OVERLOAD: L254XF3S receiving 34.7 dBm 
but max handling is 30.0 dBm (4.7 dB over limit)

Suggestions: 💡

Replace L254XF3S with higher power handling component
Select component rated for at least 37.7 dBm with 3dB safety margin

Table View: - Designator (U1, U2, etc.) - Part Number - Manufacturer
- Description - Qty, Unit Cost, Total Cost - Status (in-stock, obsolete, etc.) - Package type

Export Options: - Download CSV - Download Excel - Copy to clipboard

Click "Continue to Phase III" when ready →

Phase 3-5: ✅ All Fully Operational¶

Phase 3: ✅ Power flow analysis, BOM validation (10/10 stress tests passed)
Phase 4: ✅ PCB stackup generation (up to 32 layers), thermal analysis, visualizers
Phase 5: ✅ BOM export, KiCad/ODB++/ADS exports, DFM checks, design complete

📊 PCB Stackup Designer¶

Creating a Stackup:¶

Step 1: Choose Layer Count¶

Click layer count button: 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, or 32 layers ✨
More layers = more signal/power layers
Up to 32 layers for complex high-density designs

Step 2: Configure Stackup¶

Layer Types: - Signal: Trace routing layers - Ground: Reference planes (0V) - Power: Power planes (+V) - Mixed: Signal + power

For each layer, set: - Copper thickness: 0.5 oz, 1 oz, 2 oz - 0.5 oz = 17.5 μm (for fine lines) - 1 oz = 35 μm (standard) - 2 oz = 70 μm (high current)

Material: Select from dropdown
Changes available thicknesses automatically ✨
System finds closest thickness match
Dielectric Thickness: Auto-calculated or manual

Typical Stackups:

4-Layer Standard (1.6mm):

L1: Signal (35μm Cu)
L2: Ground Plane (35μm Cu)
L3: Power Plane (35μm Cu)
L4: Signal (35μm Cu)

8-Layer High-Speed (2.0mm):

L1: Signal (35μm Cu) - Component side
L2: Ground (35μm Cu)
L3: Signal (35μm Cu) - Stripline
L4: Power (35μm Cu)
L5: Ground (35μm Cu)
L6: Signal (35μm Cu) - Stripline
L7: Power (35μm Cu)
L8: Signal (35μm Cu) - Solder side

Step 3: Set Total Thickness¶

Target thickness (e.g., 1.6mm)
System auto-adjusts dielectric layers
Maintains manufacturability

Step 4: Validate¶

Checks: - ✓ Total thickness within tolerance - ✓ All materials compatible - ✓ Copper thicknesses manufacturable - ✓ Impedance achievable

Material Database:¶

Access 50+ materials including:

FR4 variants: FR408, FR4, IS410 (standard applications)
Rogers: RO4003C, RO4350B, RO3003 (high-frequency)
MEGTRON6: ✨ NEW! Panasonic's premium ultra-low loss material
Frequency coverage: 1-40 GHz
18 thickness options: 0.050mm to 0.925mm
Ultra-low loss: Df = 0.002 @ 10 GHz
Thermal: Tg = 185°C
Ideal for: High-performance RF, mmWave, satellite applications
Taconic: RF-35, TLY-5 (high-performance)
Isola: IS410, I-Tera MT

Each material shows: - Dielectric constant (Dk) - Updates automatically when changing materials ✨ - Loss tangent (Df) - Frequency-dependent values - Available thicknesses - Auto-matches closest standard thickness ✨ - Frequency range - Operating frequency specifications - Thermal properties - Glass transition temperature (Tg), CTE data ✨ - Professional categorization - Aerospace (🚀), Automotive (🚗), Standard (🔌) ✨ - Manufacturing compatibility - Reflow and lead-free process validation ✨ - Cost factor - Material cost estimates

Impedance Calculator:¶

Microstrip (Surface Trace): - Input: Trace width, copper thickness, dielectric height - Output: Impedance (Ω) - Target: 50Ω (typical)

Stripline (Embedded Trace): - Input: Trace width, distance to planes - Output: Impedance (Ω) - Better shielding than microstrip

Differential Pairs: - Input: Trace width, spacing, dielectric - Output: Differential impedance (Ω) - Target: 100Ω (USB, HDMI), 90Ω (PCIe)

Export Formats:¶

KiCad (.kicad_pcb):

# Opens in KiCad PCB Editor
# Stackup automatically configured
# Ready to start layout

ADS (.subst):

# Opens in Keysight ADS
# For EM simulation
# Includes all material properties

CSV/Excel:

Layer | Type | Copper | Material | Thickness | Dk | Df
──────────────────────────────────────────────────────
L1    | Sig  | 35μm   | RO4350B  | 0.203mm   | 3.48 | 0.0037
...

📤 Export & Manufacturing¶

Export Workflow:¶

1. Complete Your Design¶

RF Module: Complete all 5 phases
PCB Stackup: Validated (if using Phase 4)

2. Choose Export Format:¶

For PCB Layout: ✨ Requires Sign-In - KiCad (.kicad_pcb, .kicad_pro) - Free, powerful PCB design tool - Complete project with schematic, PCB, and symbols - Native KiCad API generation - Ready for layout and routing

For Simulation: ✨ Requires Sign-In - ADS (.subst) - Keysight, RF/microwave simulation - Substrate file with all material properties - For signal integrity simulation

For Manufacturing: ✨ Requires Sign-In - ODB++ ✅ PRODUCTION READY - Binary format with proper directory structure - Tested and verified with Keysight ADS - Industry-standard manufacturing format

For Documentation: - CSV/Excel - BOM export (no sign-in required) - Complete component list with pricing - Ready for procurement

3. Download Files¶

Click "Export" button in Phase 5
Sign in required for CAD files (KiCad, ODB++, ADS)
Download generated files
Import into your tool of choice

Freemium Access

All features are free! Sign-in is only required for downloading CAD files. You can use all design tools, generate stackups, and create BOMs without an account.

Manufacturing Partners:¶

PCB Fabrication: - JLCPCB - Affordable, fast turnaround - PCBWay - Quality, good for RF - OSH Park - US-based, community-focused - Advanced Circuits - Quick-turn prototypes

Component Sourcing: - Digi-Key - Vast selection, reliable - Mouser - Excellent RF components - Arrow - Good for volume - Samples: Request from manufacturers

Send your BOM to distributors - they'll quote pricing and lead times.

🔒 Legal & Compliance¶

Your Rights:¶

✅ YOU OWN YOUR DESIGNS - All generated files are YOUR property - Use for commercial projects without restriction - No attribution required - No licensing fees

Disclaimer (First Use):¶

When you first open the app: 1. Disclaimer modal appears 2. Must scroll to bottom to enable "I Agree" 3. Acceptance stored in browser (localStorage) 4. One-time per browser/device

What you're agreeing to: - Design verification is YOUR responsibility - Tool provides suggestions "AS IS" - We're not liable for design errors - You own all generated files - Third-party software (KiCad, etc.) requires separate licensing

Legal Pages:¶

Access from footer:

Terms of Service: - Click "Terms" in footer - Opens modal with full terms - Covers subscriptions, payments, refunds, liability - Massachusetts jurisdiction

Privacy Policy: - Click "Privacy" in footer - Opens modal with privacy policy - Data collection, usage, your rights - GDPR-compliant, US-based storage

Third-Party Licenses: - Click "Licenses" in footer - Opens modal with licensing info - KiCad, Altium format usage - Component data sources

AI Chat Assistant (Gemini):¶

The Gemini-powered AI chat sidebar provides intelligent design assistance with guided onboarding:

Smart Onboarding: - Starter Prompts: 6 clickable prompt cards in a 2-column grid — context-aware (default prompts for new users, project-specific prompts when data exists) - Auto-Open Welcome: Chat sidebar auto-opens on first visit with a local welcome message and pulsing blue dot indicator - Chat Prominence CTA: "Start Designing with AI" button that auto-hides after first interaction

In-Chat Intelligence: - Action Cards: Styled cards rendered inline for completed tool calls (rf_specs, stackup_config, block_diagram, solver, surrogate, design_template) with success/error states - Apply Design Template: One-click application of RF design templates (sets frequency, material, layers) via apply_design_template tool call - Enhanced System Prompt: Guided design knowledge, 7 common RF design templates, and comparison prompts for trade-off questions

Live AI Agent (replaces scripted demo mode): - The AI-native shell (/app/agent) drives the design end-to-end via a streamed multi-turn tool-call loop. The old scripted demo mode (?demo=, DemoBadge, demoModeService) was removed. - Public demo: a signed-out /demo/agent replay of a real captured agent run — no Gemini quota, reuses the production SSE framing and action-card registry. Backend backend/routes/demo.py, frontend frontend/src/components/Demo/ (flags FF_PUBLIC_DEMO / VITE_FF_PUBLIC_DEMO, default off in code, enabled via root .env).

Feature Flags (toggle independently via environment variables): - VITE_FF_CHAT_STARTER_PROMPTS (default: true) - VITE_FF_CHAT_AUTO_OPEN (default: true)

Chat Interface Warnings:¶

AI Input Label: Chat messages are clearly labeled as "AI Input" to distinguish from system messages
Legal Warning: A persistent legal warning appears at the bottom of the chat interface reminding users that inputs may be used for training and outputs should be verified.

Freemium Access Model: ✨ CURRENT¶

Free Access (No Sign-In Required): - ✅ All design features - RF Module Designer, PCB Stackup Designer, PA Selector - ✅ Complete 5-phase workflow - All phases fully functional - ✅ AI component selection - Full access to 2,400+ validated component database - ✅ BOM generation - Export CSV/Excel without sign-in - ✅ All materials - Access to 50+ materials including MEGTRON6 - ✅ Up to 32 layers - Full stackup generation capabilities - ✅ Thermal analysis - Enhanced thermal design validation - ✅ Design validation - All stress tests and validation features

Sign-In Required (For CAD Downloads): - 🔒 KiCad export - Download .kicad_pcb and .kicad_pro files - 🔒 ODB++ export - Download manufacturing format files - 🔒 ADS export - Download .subst substrate files

Why Sign-In for CAD Files?

Sign-in helps us track usage and prevent abuse while keeping all design features free. Your designs remain private and you own all generated files.

Future Subscription Tiers (Planned): - Starter - Enhanced features and priority support - Professional - Advanced AI, team collaboration - Enterprise - API access, SSO integration

See pricing page for full details (when monetization launches).

🎓 Tips & Best Practices¶

RF Module Design:¶

Start Conservative:
Use well-known PA (TGA2214, HMC8205)
Standard supply voltages (12V, 24V)
Realistic efficiency targets (20-30%)
Watch Post-PA Loss:
Keep < 4 dB if possible
Each dB of loss = wasted PA power
Minimize filter count
Check Alternatives:
Click PA component → Alternatives tab
Compare efficiency vs cost
Understand trade-offs
Verify Stress Analysis:
Fix any power overload errors
Add safety margins (3 dB typical)
Consider derating for reliability
Review Power Tree:
Minimize converter count
Match voltage rails to components
Check efficiency percentages

PCB Stackup Design:¶

Follow Industry Standards:
4-layer: 1.6mm total
6-layer: 1.6mm or 2.0mm
8-layer: 2.0mm or 2.4mm
Reference Plane Strategy:
Every signal layer needs adjacent ground/power plane
Symmetrical stackup (balanced copper)
Core in the middle
Material Selection:
< 1 GHz: FR4 is fine (cheap)
1-10 GHz: Rogers RO4003C (good balance)
10 GHz: Rogers RO4350B or Taconic (low loss)
Copper Weight:
Signal layers: 0.5 oz (fine lines) or 1 oz (standard)
Power layers: 1 oz or 2 oz (high current)
Impedance Control:
50Ω for RF (standard)
75Ω for video/coax
90Ω/100Ω for differential (USB, HDMI, PCIe)

⚠️ Common Issues & Solutions¶

RF Module Issues:¶

Issue: "No suitable PA found" - Cause: Requirements too strict (high power + high frequency + high efficiency) - Fix: Relax efficiency target or increase budget - Alternative: Use two-stage PA

Issue: "Attenuator gap error" - Cause: No attenuator available for required value (e.g., 19 dB) - Fix: AI automatically selects different PA to avoid gaps - Manual: Check alternatives for PA with different gain

Issue: "Power overload warning" - Cause: Component receiving more power than rated - Fix: Follow suggestions in Validation Results - Options: Replace component or add attenuator

Issue: "High DC power consumption" - Cause: Low efficiency PA or multiple stages - Fix: Check PA alternatives for higher efficiency - Trade-off: Higher efficiency PAs often more expensive

PCB Stackup Issues:¶

Issue: "Total thickness doesn't match target" - Cause: Material thicknesses don't sum to target - Fix: Adjust dielectric thicknesses manually - Auto: Click "Auto-adjust" to distribute evenly

Issue: "Material not available in this thickness" - Cause: Selected thickness not standard for material - Fix: System auto-selects closest standard thickness - Manual: Check material datasheet for available thicknesses

Issue: "Impedance calculation shows N/A" - Cause: Invalid trace dimensions for material - Fix: Adjust trace width or dielectric height - Typical: 0.2-0.5mm trace width for 50Ω

Issue: "Export fails" - Cause: Server maintenance or connection issue - Fix: Check your internet connection - Try: Refresh the page or try again in a few moments - Contact: support@pcbgenerator.com if issue persists

General Issues:¶

Issue: "Page won't load" - Check internet connection - Try different browser - Clear browser cache (Ctrl + Shift + R) - Disable browser extensions temporarily

Issue: "Disclaimer appears every time" - Cause: Browser blocking cookies/storage - Fix: Allow cookies for pcbgenerator.com - Alternative: Try different browser or incognito/private mode

Issue: "Slow component selection" - First design: May take 10-15 seconds (database loading) - Subsequent designs: Faster (5-10 seconds) - This is normal: Cloud-based AI processing

📞 Support & Resources¶

Documentation:¶

This User Guide: Comprehensive usage guide
README.md: Quick start and setup
PHASE_IMPLEMENTATION_PLAN.md: Feature roadmap
MONETIZATION_STRATEGY.md: Business plan

Legal:¶

Terms of Service: User agreement
Privacy Policy: Data handling
Third-Party Notices: Licensing info

Contact:¶

Email: support@pcbgenerator.com
Support: Contact support team for bug reports and feature requests
Internal Issue Tracker: Use internal project management tools

Learning Resources:¶

RF Design: - "RF Circuit Design" by Chris Bowick - "Practical RF Circuit Design for Modern Wireless Systems" by Gilmore & Besser - Qorvo Application Notes: https://www.qorvo.com/resources - Mini-Circuits Design Tools: https://www.minicircuits.com

PCB Stackup: - IPC-2141A: Controlled Impedance Design - IPC-2221: PCB Design Standard - Rogers PCB Design Guide: https://rogerscorp.com - Sierra Circuits PCB Resources: https://www.protoexpress.com

KiCad: - Official Documentation: https://docs.kicad.org - Getting Started Guide - Forum: https://forum.kicad.info

🚀 Quick Reference¶

Keyboard Shortcuts:¶

Ctrl + Z - Undo (stackup editor)
Ctrl + S - Save design (future)
Esc - Close modal
F5 - Refresh app

Component Categories:¶

Category	Function	Example
VCO	Frequency source	LMX2581
Predriver	Low-level amplification	CMD244K5
Driver	Mid-level amplification	QPL9547
PA	High-power amplification	TGA2214
Attenuator	Power control	YAT-3A+
BPF	Bandpass filtering	L254XF3S
Circulator	PA protection	RCI-2G4-S1
Filter	Output cleanup	CF-02600101
Connector	RF interface	SMA, U.FL

Power Conversions:¶

dBm	Watts	mW
0	1 mW	1
10	10 mW	10
20	100 mW	100
30	1 W	1000
33	2 W	2000
37	5 W	5000
40	10 W	10000

Formula: Power(mW) = 10^(dBm/10)

Typical Frequencies:¶

Application	Frequency
AM Radio	0.5-1.6 MHz
FM Radio	88-108 MHz
Cellular 2G/3G	850-1900 MHz
WiFi 2.4 GHz	2.4-2.5 GHz
4G/LTE	700-2600 MHz
WiFi 5 GHz	5.15-5.85 GHz
5G Sub-6	3.3-4.2 GHz
5G mmWave	24-40 GHz
Satellite Ka	18-40 GHz

🎉 What's New (Version 3.0)¶

January 2026 Updates:¶

✨ All 5 Phases Fully Operational - Phase 3: Power flow analysis, BOM validation (10/10 stress tests) ✅ - Phase 4: PCB stackup generation (up to 32 layers) ✅ - Phase 5: BOM export, CAD exports, DFM checks ✅ - Complete end-to-end workflow from requirements to manufacturing files

✨ MEGTRON6 Ultra-Low Loss Material - Panasonic's premium material for high-performance RF - 18 thickness options (0.050mm to 0.925mm) - Frequency coverage: 1-40 GHz - Thermal properties: Tg = 185°C - Ideal for mmWave and satellite applications

✨ Enhanced Thermal Analysis - CTE (Coefficient of Thermal Expansion) validation - Operating temperature range analysis - Heat capacity calculations - Professional design rule checking - Instant analysis with intelligent filtering

✨ Freemium Access Model - All features free to use - Sign-in only required for CAD file downloads - Seamless user experience - Quick email/password or Google OAuth sign-up

✨ Material Property Updates - Dk/df values update correctly when changing materials - Auto-thickness matching when switching materials - Professional material categorization (Aerospace, Automotive, Standard)

✨ Up to 32-Layer Stackups - Support for complex high-density designs - Enhanced layer management - Smart core/prepreg assignment

November 2025 Updates (Version 2.0):¶

✨ Phase-Based GUI - Sequential 5-phase workflow - Clear progress tracking - Data persistence between phases

✨ Component Selection Explanations - Info icons (ℹ️) on all major components - Tooltips with reasoning - Alternatives tab with pros/cons - Scoring transparency

✨ Enhanced Chain Analysis - Design Strategy tab - Key decisions explained - Alternative analyses

✨ Real Alternatives from Database - VCO alternatives (top 5) - Driver alternatives (top 5) - PA alternatives (top 5) - Dynamic pros/cons generation

✨ Legal Compliance - Terms of Service - Privacy Policy - Third-Party Licenses - Enhanced disclaimer

✨ Better Validation - Electrical stress analysis - Power overload detection - Actionable suggestions

📚 Glossary¶

RF Terms: - dBm: Power in decibels relative to 1 milliwatt - PA: Power Amplifier - VCO: Voltage Controlled Oscillator - PAE: Power Added Efficiency - P1dB: 1 dB compression point (linearity limit) - BPF: Bandpass Filter - Circulator: Isolates PA from reflections

PCB Terms: - Dk: Dielectric constant (Er) - Df: Dissipation factor (loss tangent) - HDI: High Density Interconnect - Microvia: Small laser-drilled via (<150μm) - Stripline: Trace between two planes - Microstrip: Trace on surface with plane below - Impedance: Characteristic impedance of transmission line (Ω)

💡 Pro Tips¶

Save Screenshots: Capture your designs for documentation
Compare Alternatives: Always check top 3 alternatives
Understand Trade-offs: Read reasoning tabs to learn
Verify with Manufacturer: Always check datasheets
Start Simple: Begin with standard components before exotic ones
Budget Wisely: Free samples available for many components
Plan for Margin: Add 3 dB safety margin for reliability
Test Early: Prototype and test before production

🎓 Need Help?¶

Email: support@pcbgenerator.com
Support: Contact support team for assistance
Internal Resources: Use internal documentation and team communication channels

Happy Designing! 🚀

📝 Version History¶

Version 3.1.x (March–July 2026)¶

✅ AI-native shell (/app/agent) — agent-loop chat canvas alongside the Guided wizard
✅ Public signed-out demo replay (/demo/agent)
✅ Standalone calculators: impedance, link budget, patch antenna, planar filter
✅ Unified thermal analysis (Phase 26) with backend parity
✅ PDN impedance, compliance checks, design intelligence agent tools
✅ Grounding visibility (computed-by badges, /how-we-ground)

Version 3.0 (January 8, 2026)¶

✅ All 5 phases fully operational and tested
✅ MEGTRON6 ultra-low loss material support
✅ Enhanced thermal analysis with CTE validation
✅ Freemium access model (sign-in only for CAD downloads)
✅ Up to 32-layer stackup support
✅ Material property auto-updates
✅ Professional material categorization

Version 2.0 (November 2025)¶

✅ Phase-based GUI implementation
✅ Component selection explanations
✅ Enhanced chain analysis
✅ Real alternatives from database
✅ Legal compliance (Terms, Privacy, Licenses)
✅ Better validation with stress analysis

Version 1.0 (Initial Release)¶

✅ RF Module Designer
✅ PCB Stackup Designer
✅ PA Selector Tool
✅ Basic AI component selection
✅ KiCad export

Documentation Version Control: - This guide follows semantic versioning - Major updates documented in CHANGELOG.md - Feature requests and bug reports: support@pcbgenerator.com

📖 MagicON AI - Complete User Guide¶

🎯 Quick Start¶

Accessing the Application¶

📋 Table of Contents¶

🌟 Application Overview¶

Three Main Tools:¶

Key Features:¶

🔬 RF Module Designer¶

Phase-Based Design Workflow:¶

📋 Phase 1: Requirements & Specifications¶

🧱 Phase 2: Block Diagram & Components¶

Enable AI Component Selection:¶

Understanding the Chain Diagram:¶

Component Details Panel:¶

Info Icons (ℹ️):¶

Chain Analysis:¶

Selected Components List:¶

Power Delivery Network (PDN):¶

Bill of Materials (BOM):¶

Electrical Stress Analysis: 🆕¶

📉 Phase 3: Link Budget & Simulation ✅ FULLY OPERATIONAL¶

Power Flow Analysis:¶

BOM Validation & Stress Testing:¶

Link Budget Metrics:¶

Chain Analysis Display:¶

📝 Phase 4: Passive Design & PCB Integration ✅ FULLY OPERATIONAL¶

PCB Stackup Generation:¶

Stackup Visualizers:¶

Material Database:¶

Enhanced Thermal Analysis: ✨¶

Design Features:¶

✍️ Phase 5: Schematic & Verification ✅ FULLY OPERATIONAL¶

Bill of Materials (BOM) Export:¶

CAD File Exports: ✨ Requires Sign-In¶

Design Verification:¶

Design Complete Summary:¶

Start New Design:¶

📊 PCB Stackup Designer¶

How to Use:¶

Step 1: Select Layer Count¶

Step 2: Configure Layers¶

Step 3: Set Total Thickness¶

Step 4: Validate¶

Advanced Features:¶

Impedance Calculator:¶

Via Technology:¶

Material Library:¶

Export Options:¶

⚡ PA Selector Tool¶

How to Use:¶

🤖 Component Selection AI¶

How It Works:¶

Power Amplifier (PA) Selection:¶

Driver Selection:¶

VCO Selection:¶

Understanding Component Reasoning:¶

Info Icons (ℹ️):¶

Alternatives Tab:¶

Scoring Transparency:¶

🔧 RF Module Designer - Detailed Guide¶

Phase 1: Requirements¶

Phase 2: Block Diagram & Components¶

Current Specifications Panel:¶

AI Component Selection:¶

Component Tooltips:¶

Chain Analysis:¶

Power Delivery Network:¶

Bill of Materials:¶

Phase 3-5: ✅ All Fully Operational¶

📊 PCB Stackup Designer¶

Creating a Stackup:¶

Step 1: Choose Layer Count¶

Step 2: Configure Stackup¶

Step 3: Set Total Thickness¶

Step 4: Validate¶

Material Database:¶

Impedance Calculator:¶

Export Formats:¶

📤 Export & Manufacturing¶

Export Workflow:¶