PCB Stackup Design — LinkedIn Article Series¶
8 LinkedIn articles adapted from the technical series, each focused on a single stackup design domain. Technical and informative tone — not promotional.
| # | Article | Topic |
|---|---|---|
| 1 | The 7 Domains Behind Every PCB Stack-Up | Overview of 7 stackup design domains |
| 2 | Material Selection and Impedance Targeting | Dk/Df frequency dependence, hybrid stackups, 5 impedance geometries |
| 3 | Signal Integrity Beyond Impedance | Etch compensation, crosstalk, propagation delay, copper roughness, glass weave |
| 4 | Power Integrity Starts in the Stackup | Interplanar capacitance, target impedance, Z(f) profiles, resonance |
| 5 | Thermal Engineering in the Stackup | Via Rth, spreading resistance, barrel stress, warpage, resin flow |
| 6 | Compliance Checking for PCB Stackups | IPC/MIL standards, environmental regulations, automated checking |
| 7 | Test Coupons and Export Formats | TDR coupons, 8 export formats, sidecar metadata |
| 8 | Design Intelligence and Manufacturing Yield | Yield intelligence loop, design DNA, fab network intelligence |
| C1 | Case Study — 5G n78 PA, three small proofs | Z₀, loss, and T_j — one experiment each, ~1 hr per solver |
Target audience: Hardware engineers, RF designers, SI/PI engineers, compliance engineers, and engineering managers on LinkedIn.
Format notes: No markdown tables (LinkedIn doesn't render them). Short paragraphs (2-3 sentences max). Hook in first 210 characters. Engagement question at end. ~1,500 words each.